No more packaging – Package-less Package. That is the fundamental solution which manufacturers are looking for to meet the market demands. Unfortunately, the era of Flip Chip-Chip Scale LED Package (FC CSP LED) is, however, emerging. It will make the time of the wide spread of LED light coming slowly step by step.

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Any LED manufacturers who aggressively jump over FC CSP LED and current leading-edge packaging technologies would be expected under the paradigm of no more packaging. A little of endeavour has been conducted to fulfil package-less package like Phosphor on Die and Package Free Chip. Driver License Reinstatement Fee Indiana. Wafer Level Chip Scale LED Package (WLCSP LED) is the solution of package-less package. Without any doubt the simplest configuration of LED package is to only form solderable pads directly on the LED chip without any other elements. Download Game Crysis 1 Pc Rip. WLCSP LED produces tens of wafers which have thousands up to ten thousands of LED packages formed directly on the epitaxial wafer by only forming the solder pads on the LED chips, while the existing LED packaging technology produces individual LED packages with LED chips diced from the epitaxial wafer. Wafer level CSP for phosphor converted LED.